Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/62443
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Type: Journal article
Title: 3-D system-on-system (SoS) biomedical-imaging architecture for health-care applications
Author: Lee, S.
Kavehei, O.
Hong, Y.
Cho, T.
You, Y.
Cho, K.
Eshraghian, K.
Citation: IEEE Transactions on Biomedical Circuits and Systems, 2010; 4(6):426-436
Publisher: IEEE
Issue Date: 2010
ISSN: 1932-4545
1940-9990
Statement of
Responsibility: 
Sang-Jin Lee; Kavehei, O.; Yoon-Ki Hong; Tae Won Cho; Younggap You; Kyoungrok Cho and Eshraghian, K.
Abstract: This paper presents the implementation of a 3-D architecture for a biomedical-imaging system based on a multilayered system-on-system structure. The architecture consists of a complementary metal-oxide semiconductor image sensor layer, memory, 3-D discrete wavelet transform (3D-DWT), 3-D Advanced Encryption Standard (3D-AES), and an RF transmitter as an add-on layer. Multilayer silicon (Si) stacking permits fabrication and optimization of individual layers by different processing technology to achieve optimal performance. Utilization of through silicon via scheme can address required low-power operation as well as high-speed performance. Potential benefits of 3-D vertical integration include an improved form factor as well as a reduction in the total wiring length, multifunctionality, power efficiency, and flexible heterogeneous integration. The proposed imaging architecture was simulated by using Cadence Spectre and Synopsys HSPICE while implementation was carried out by Cadence Virtuoso and Mentor Graphic Calibre.
Rights: © Copyright 2010 IEEE – All Rights Reserved
DOI: 10.1109/TBCAS.2010.2079330
Appears in Collections:Aurora harvest
Electrical and Electronic Engineering publications

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